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Phyplus Technologies participated in the 2018 Bluetooth Asia Conference
Date：2018-05-22
Author： Phyplus
From May 30 to 31, 2018, Phyplus Technologies will participate in the 2018 Bluetooth Asia Conference held at the Shenzhen Convention and Exhibition Center, booth number 50. Phyplus Technologies will showcase the ultra-low power and ZigBee multi-mode wireless communication IoT chip PHY62 series, which will be officially sold in the second quarter of this year.
The PHY62 series is a system-level chip series that provides multiple 2.4GHz wireless communication protocols such as low-power Bluetooth and ZigBee and ARM core computing. The PHY62 series provides the lowest power consumption, the highest integration and the best cost-effectiveness. The chip products use 55 nanometer technology and can simultaneously support multiple communication protocols such as low-power Bluetooth, Bluetooth 5.0, Bluetooth MESH, ZigBee, Google Thread, Mist, etc., for applications such as smart terminal peripherals, smart voice, smart home, smart manufacturing, and smart transportation.
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